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UNE-EN IEC 60749-5:2024 UNE
Status: Vigente/ 2024-03-01
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (Endorsed by Asociación Española de Normalización in March of 2024.)
UNE-EN IEC 63287-2:2023 UNE
Status: Vigente/ 2023-06-01
Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile (Endorsed by Asociación Española de Normalización in June of 2023.)
UNE-EN IEC 60749-37:2022 UNE
Status: Vigente/ 2023-01-01
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (Endorsed by Asociación Española de Normalización in January of 2023.)
UNE-EN 62007-1:2015/A1:2022 UNE
Status: Vigente/ 2022-12-01
Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics (Endorsed by Asociación Española de Normalización in December of 2022.)
UNE-EN IEC 60749-10:2022 UNE
Status: Vigente/ 2022-07-01
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly (Endorsed by Asociación Española de Normalización in July of 2022.)
UNE-EN IEC 60749-28:2022 UNE
Status: Vigente/ 2022-05-01
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level (Endorsed by Asociación Española de Normalización in May of 2022.)
UNE-EN IEC 60749-39:2022 UNE
Status: Vigente/ 2022-03-01
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components (Endorsed by Asociación Española de Normalización in March of 2022.)
UNE-EN IEC 63287-1:2021 UNE
Status: Vigente/ 2021-11-01
Semiconductor devices - Generic semiconductor qualification guidelines - Part 1: Guidelines for IC reliability qualification (Endorsed by Asociación Española de Normalización in November of 2021.)
UNE-EN IEC 60747-17:2020/AC:2021-02 UNE
Status: Vigente/ 2021-03-01
Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation (Endorsed by Asociación Española de Normalización in March of 2021.)
UNE-EN IEC 60747-17:2020 UNE
Status: Vigente/ 2021-01-01
Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation (Endorsed by Asociación Española de Normalización in January of 2021.)
UNE-EN IEC 60749-15:2020 UNE
Status: Vigente/ 2020-11-01
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (Endorsed by Asociación Española de Normalización in November of 2020.)
UNE-EN IEC 60749-30:2020 UNE
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (Endorsed by Asociación Española de Normalización in November of 2020.)
UNE-EN IEC 60749-20:2020 UNE
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (Endorsed by Asociación Española de Normalización in November of 2020.)
UNE-EN IEC 60747-5-5:2020 UNE
Status: Vigente/ 2020-10-01
Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers (Endorsed by Asociación Española de Normalización in October of 2020.)
UNE-EN IEC 60749-41:2020 UNE
Semiconductor devices - Mechanical and climatic test methods - Part 41: Standard reliability testing methods of non-volatile memory devices (Endorsed by Asociación Española de Normalización in October of 2020.)
UNE-EN IEC 60749-18:2019 UNE
Status: Vigente/ 2019-07-01
Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose) (Endorsed by Asociación Española de Normalización in July of 2019.)
UNE-EN IEC 60749-17:2019 UNE
Status: Vigente/ 2019-06-01
Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (Endorsed by Asociación Española de Normalización in June of 2019.)
UNE-EN 60191-4:2014/A1:2018 UNE
Status: Vigente/ 2018-06-01
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (Endorsed by Asociación Española de Normalización in June of 2018.)
UNE-EN IEC 60749-26:2018 UNE
Status: Vigente/ 2018-05-01
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (Endorsed by Asociación Española de Normalización in May of 2018.)
UNE-EN IEC 60191-1:2018 UNE
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (Endorsed by Asociación Española de Normalización in May of 2018.)
UNE-EN IEC 60749-13:2018 UNE
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (Endorsed by Asociación Española de Normalización in May of 2018.)
UNE-EN IEC 60749-12:2018 UNE
Status: Vigente/ 2018-04-01
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency (Endorsed by Asociación Española de Normalización in April of 2018.)
UNE-EN 60749-5:2017 UNE
Status: Vigente/ 2017-08-01
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test (Endorsed by Asociación Española de Normalización in August of 2017.)
UNE-EN 60749-9:2017 UNE
Status: Vigente/ 2017-07-01
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (Endorsed by Asociación Española de Normalización in July of 2017.)
UNE-EN 60749-6:2017 UNE
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature (Endorsed by Asociación Española de Normalización in July of 2017.)
UNE-EN 60749-4:2017 UNE
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (Endorsed by Asociación Española de Normalización in July of 2017.)
UNE-EN 60749-3:2017 UNE
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination (Endorsed by Asociación Española de Normalización in July of 2017.)
UNE-EN 60191-6-13:2016 UNE
Status: Vigente/ 2017-01-01
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (Endorsed by Asociación Española de Normalización in January of 2017.)
UNE-EN 60749-44:2016 UNE
Status: Vigente/ 2016-12-01
Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)
UNE-EN 62779-1:2016 UNE
Status: Vigente/ 2016-07-01
Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (Endorsed by AENOR in July of 2016.)
UNE-EN 62779-2:2016 UNE
Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (Endorsed by AENOR in July of 2016.)
UNE-EN 62779-3:2016 UNE
Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (Endorsed by AENOR in July of 2016.)
UNE-EN 62007-1:2015 UNE
Status: Vigente/ 2015-08-01
Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics (Endorsed by AENOR in August of 2015.)
UNE 21302-521:2004 UNE
Status: Current/2015-01-23
International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
UNE-EN 60749-42:2014 UNE
Status: Vigente/ 2014-11-01
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage (Endorsed by AENOR in November of 2014.)
UNE-EN 60191-4:2014 UNE
Status: Vigente/ 2014-05-01
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (Endorsed by AENOR in May of 2014.)
UNE-EN 60191-6-22:2013 UNE
Status: Vigente/ 2013-04-01
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (Endorsed by AENOR in April of 2013.)
UNE-EN 60749-27:2006/A1:2012 UNE
Status: Vigente/ 2013-01-01
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (Endorsed by AENOR in January of 2013.)
UNE-EN 60749-23:2005/A1:2011 UNE
Status: Vigente/ 2011-12-21
Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life
UNE-EN 60749-7:2011 UNE
Status: Vigente/ 2011-12-01
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (Endorsed by AENOR in December of 2011.)
UNE-EN 60749-40:2011 UNE
Status: Vigente/ 2011-11-01
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge (Endorsed by AENOR in November of 2011.)
UNE-EN 60191-6-12:2011 UNE
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (Endorsed by AENOR in November of 2011.)
UNE-EN 60749-29:2011 UNE
Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (Endorsed by AENOR in November of 2011.)
UNE-EN 60749-21:2011 UNE
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (Endorsed by AENOR in November of 2011.)
UNE-EN 60191-6-17:2011 UNE
Status: Vigente/ 2011-09-01
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (Endorsed by AENOR in September of 2011.)
UNE-EN 60749-34:2011 UNE
Status: Vigente/ 2011-07-20
Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
UNE-EN 60191-6-21:2010 UNE
Status: Vigente/ 2011-02-01
Mechanical standardization of semiconductor devices -- Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (Endorsed by AENOR in February of 2011.)
UNE-EN 60191-6-20:2010 UNE
Mechanical standardization of semiconductor devices -- Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (Endorsed by AENOR in February of 2011.)
UNE-EN 60749-19:2003/A1:2011 UNE
Status: Vigente/ 2011-01-19
Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
UNE-EN 60749-32:2004/A1:2011 UNE
Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
