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Number of results 319

UNE-EN 60749-23:2005/A1:2011  UNE

Status: Vigente/ 2011-12-21

Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life

UNE-EN 60749-30:2005/A1:2011  UNE

Status: Anulada/ 2023-09-22

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

UNE-EN 60749-34:2011  UNE

Status: Vigente/ 2011-07-20

Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling

UNE-EN 60749-15:2011  UNE

Status: Anulada/ 2023-08-19

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

UNE-EN 60749-19:2003/A1:2011  UNE

Status: Vigente/ 2011-01-19

Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength

UNE-EN 60749-32:2004/A1:2011  UNE

Status: Vigente/ 2011-01-19

Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)

UNE-EN 61988-4:2007  UNE

Status: Anulada/ 2023-09-21

Plasma display panels - Part 4: Climatic and mechanical testing methods

UNE-EN 61988-3-1:2006  UNE

Status: Vigente/ 2006-04-12

Plasma display panels -- Part 3-1: Mechanical interface

UNE-EN 60749-30:2005  UNE

Status: Anulada/ 2023-09-22

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

UNE-EN 61988-1:2005  UNE

Status: Anulada/ 2014-08-31

Plasma display panels -- Part 1: Terminology and letter symbols

UNE-EN 60749-34:2005  UNE

Status: Anulada/ 2013-12-01

Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling

UNE-EN 60749-33:2005  UNE

Status: Vigente/ 2005-03-16

Semiconductor devices - Mechanical and climatic test methods -- Part 33: Accelerated moisture resistance - Unbiased autoclave

UNE-EN 60749-24:2005  UNE

Status: Vigente/ 2005-03-16

Semiconductor devices - Mechanical and climatic test methods -- Part 24: Accelerated moisture resistance - Unbiased HAST

UNE-EN 60749-23:2005  UNE

Status: Vigente/ 2005-03-16

Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life

UNE-EN 60749-29:2004  UNE

Status: Anulada/ 2014-07-10

Semiconductor devices - Mechanical and climatic test methods -- Part 29: Latch-up test

UNE-EN 60749-14:2004  UNE

Status: Vigente/ 2004-06-11

Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)

UNE-EN 60749-20:2004  UNE

Status: Anulada/ 2012-09-02

Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

UNE-EN 60749-25:2004  UNE

Status: Vigente/ 2004-06-11

Semiconductor devices - Mechanical and climatic test methods -- Part 25: Temperature cycling

UNE-EN 60749-1:2004  UNE

Status: Vigente/ 2004-05-28

Semiconductor devices - Mechanical and climatic test methods -- Part 1: General

UNE-EN 60749-8:2004  UNE

Status: Vigente/ 2004-05-28

Semiconductor devices - Mechanical and climatic test methods -- Part 8: Sealing

UNE-EN 61988-2-2:2004  UNE

Status: Anulada/ 2015-03-01

Plasma display panels -- Part 2-2: Measuring methods - Optoelectrical

UNE-EN 60191-6-10:2004  UNE

Status: Vigente/ 2004-05-28

Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

UNE-EN 60191-6-12:2004  UNE

Status: Anulada/ 2014-07-13

Mechanical standardization of semiconductor devices -- Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

UNE-EN 60749-22:2004  UNE

Status: Vigente/ 2004-03-26

Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength

UNE-EN 60749-36:2004  UNE

Status: Vigente/ 2004-03-18

Semiconductor devices - Mechanical and climatic test methods -- Part 36: Acceleration, steady state

UNE-EN 60749-31:2004  UNE

Status: Vigente/ 2004-03-18

Semiconductor devices - Mechanical and climatic test methods -- Part 31: Flammability of plastic-encapsulated devices (internally induced)

UNE-EN 60749-32:2004  UNE

Status: Vigente/ 2004-03-18

Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)

UNE-EN 60749-19:2003  UNE

Status: Vigente/ 2003-11-21

Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength

UNE-EN 60749-18:2003  UNE

Status: Anulada/ 2022-05-16

Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

UNE-EN 60749-15:2003  UNE

Status: Anulada/ 2013-12-01

Semiconductor devices - Mechanical and climatic test methods -- Part 15: Resistance to soldering temperature for through-hole mounted devices

UNE-EN 60749-17:2003  UNE

Status: Anulada/ 2022-05-03

Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

UNE-EN 60749-16:2003  UNE

Status: Vigente/ 2003-11-21

Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND)

UNE-EN 60749-5:2003  UNE

Status: Anulada/ 2020-05-16

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

UNE-EN 60191-6-2:2003  UNE

Status: Vigente/ 2003-10-10

Mechanical standardization of semiconductor devices -- Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

UNE-EN 61988-2-1:2003  UNE

Status: Anulada/ 2015-03-01

Plasma display panels -- Part 2-1: Measuring methods -- Optical.

UNE-EN 60749-7:2003  UNE

Status: Anulada/ 2014-07-22

Semiconductor devices - Mechanical and climatic test methods -- Part 7: Internal moisture content measurement and the analysis of other residual gases.

UNE-EN 60749-11:2003  UNE

Status: Vigente/ 2003-05-30

Semiconductor devices - Mechanical and climatic test methods -- Part 11: Rapid change of temperature - Two-fluid-bath method.

UNE-EN 60749-6:2003  UNE

Status: Anulada/ 2020-04-08

Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature

UNE-EN 60749-9:2003  UNE

Status: Anulada/ 2020-04-08

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

UNE-EN 60749-10:2003  UNE

Status: Anulada/ 2025-06-02

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock

UNE-EN 60749-12:2003  UNE

Status: Anulada/ 2021-01-18

Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency

UNE-EN 60749-13:2003  UNE

Status: Anulada/ 2021-03-23

Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere

UNE-EN 60749-3:2003  UNE

Status: Anulada/ 2020-04-08

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

UNE-EN 60749-2:2003  UNE

Status: Vigente/ 2003-05-30

Semiconductor devices - Mechanical and climatic test methods -- Part 2: Low air pressure.

UNE-EN 60749-4:2003  UNE

Status: Anulada/ 2020-04-08

Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

UNE-EN 60191-4/A2:2003  UNE

Status: Anulada/ 2016-11-14

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

UNE-EN 60749/A2:2002  UNE

Status: Anulada/ 2005-10-01

Semiconductor devices - Mechanical and climatic test methods.

UNE-EN 60191-4/A1:2002  UNE

Status: Anulada/ 2016-11-14

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

UNE-EN 60191-6-8:2002  UNE

Status: Vigente/ 2002-06-28

Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).

UNE-EN 60191-6-1:2002  UNE

Status: Vigente/ 2002-06-28

Mechanical standardization of semiconductor devices -- Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals.

Number of results 319

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