Clear filters Apply
Results for:
Number of results 152
UNE-EN 60749-23:2005/A1:2011 UNE
Status: Vigente/ 2011-12-21
Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life
UNE-EN 60749-30:2005/A1:2011 UNE
Status: Anulada/ 2023-09-22
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
UNE-EN 60749-34:2011 UNE
Status: Vigente/ 2011-07-20
Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
UNE-EN 60749-15:2011 UNE
Status: Anulada/ 2023-08-19
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
UNE-EN 60749-19:2003/A1:2011 UNE
Status: Vigente/ 2011-01-19
Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength
UNE-EN 60749-32:2004/A1:2011 UNE
Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
UNE-EN 60749-30:2005 UNE
UNE-EN 60749-34:2005 UNE
Status: Anulada/ 2013-12-01
UNE-EN 60749-33:2005 UNE
Status: Vigente/ 2005-03-16
Semiconductor devices - Mechanical and climatic test methods -- Part 33: Accelerated moisture resistance - Unbiased autoclave
UNE-EN 60749-24:2005 UNE
Semiconductor devices - Mechanical and climatic test methods -- Part 24: Accelerated moisture resistance - Unbiased HAST
UNE-EN 60749-23:2005 UNE
UNE-EN 60749-29:2004 UNE
Status: Anulada/ 2014-07-10
Semiconductor devices - Mechanical and climatic test methods -- Part 29: Latch-up test
UNE-EN 60749-14:2004 UNE
Status: Vigente/ 2004-06-11
Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)
UNE-EN 60749-20:2004 UNE
Status: Anulada/ 2012-09-02
Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
UNE-EN 60749-25:2004 UNE
Semiconductor devices - Mechanical and climatic test methods -- Part 25: Temperature cycling
UNE-EN 60749-1:2004 UNE
Status: Vigente/ 2004-05-28
Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
UNE-EN 60749-8:2004 UNE
Semiconductor devices - Mechanical and climatic test methods -- Part 8: Sealing
UNE-EN 60191-6-10:2004 UNE
Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
UNE 21302-521:2004 UNE
Status: Current/2015-01-23
International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits
UNE-EN 60191-6-12:2004 UNE
Status: Anulada/ 2014-07-13
Mechanical standardization of semiconductor devices -- Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
UNE-EN 60749-22:2004 UNE
Status: Vigente/ 2004-03-26
Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength
UNE-EN 60749-36:2004 UNE
Status: Vigente/ 2004-03-18
Semiconductor devices - Mechanical and climatic test methods -- Part 36: Acceleration, steady state
UNE-EN 60749-31:2004 UNE
Semiconductor devices - Mechanical and climatic test methods -- Part 31: Flammability of plastic-encapsulated devices (internally induced)
UNE-EN 60749-32:2004 UNE
UNE-EN 60749-19:2003 UNE
Status: Vigente/ 2003-11-21
UNE-EN 60749-18:2003 UNE
Status: Anulada/ 2022-05-16
Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)
UNE-EN 60749-15:2003 UNE
Semiconductor devices - Mechanical and climatic test methods -- Part 15: Resistance to soldering temperature for through-hole mounted devices
UNE-EN 60749-17:2003 UNE
Status: Anulada/ 2022-05-03
Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation
UNE-EN 60749-16:2003 UNE
Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND)
UNE-EN 60749-5:2003 UNE
Status: Anulada/ 2020-05-16
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
UNE-EN 60191-6-2:2003 UNE
Status: Vigente/ 2003-10-10
Mechanical standardization of semiconductor devices -- Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
UNE-EN 60749-7:2003 UNE
Status: Anulada/ 2014-07-22
Semiconductor devices - Mechanical and climatic test methods -- Part 7: Internal moisture content measurement and the analysis of other residual gases.
UNE-EN 60749-11:2003 UNE
Status: Vigente/ 2003-05-30
Semiconductor devices - Mechanical and climatic test methods -- Part 11: Rapid change of temperature - Two-fluid-bath method.
UNE-EN 60749-6:2003 UNE
Status: Anulada/ 2020-04-08
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
UNE-EN 60749-9:2003 UNE
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
UNE-EN 60749-10:2003 UNE
Status: Anulada/ 2025-06-02
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
UNE-EN 60749-12:2003 UNE
Status: Anulada/ 2021-01-18
Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
UNE-EN 60749-13:2003 UNE
Status: Anulada/ 2021-03-23
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
UNE-EN 60749-3:2003 UNE
Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
UNE-EN 60749-2:2003 UNE
Semiconductor devices - Mechanical and climatic test methods -- Part 2: Low air pressure.
UNE-EN 60749-4:2003 UNE
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
UNE-EN 60191-4/A2:2003 UNE
Status: Anulada/ 2016-11-14
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
UNE-EN 60749/A2:2002 UNE
Status: Anulada/ 2005-10-01
Semiconductor devices - Mechanical and climatic test methods.
UNE-EN 60191-4/A1:2002 UNE
UNE-EN 60191-6-8:2002 UNE
Status: Vigente/ 2002-06-28
Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).
UNE-EN 60191-6-1:2002 UNE
Mechanical standardization of semiconductor devices -- Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals.
UNE-EN 60191-6-5:2002 UNE
Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine -pitch ball grid array (FBGA).
UNE-EN 60191-6-6:2002 UNE
Status: Vigente/ 2002-03-21
Mechanical standardization of semiconductor devices -- Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
UNE-EN 60749/A1:2001 UNE
UNE-EN 60191-3:2001 UNE
Status: Vigente/ 2001-01-31
Mechanical standardization of semiconductor devices -- Part 3: General rules for the preparation of outline drawings of integrated circuits.
