Committee

Committee:

CTN 209/SC 47 - Semiconductor devices

Secretary:
UNE - ASOCIACIÓN ESPAÑOLA DE NORMALIZACIÓN
International Relations:

IEC/TC 47  Semiconductor devices

CLC/TC 47X  Semiconductors and Trusted Chips Implementation

Standards developed by the committee: CTN 209/SC 47: 299

UNE-EN 62415:2010 (Ratificada)

Status: VIGENTE /  2010-09-01

Semiconductor devices - Constant current electromigration test (Endorsed by AENOR in September of 2010.)

UNE-EN 62416:2010 (Ratificada)

Status: VIGENTE /  2010-09-01

Semiconductor devices - Hot carrier test on MOS transistors (Endorsed by AENOR in September of 2010.)

UNE-EN 62417:2010 (Ratificada)

Status: VIGENTE /  2010-09-01

Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs) (Endorsed by AENOR in September of 2010.)

UNE-EN 60191-6-19:2010 (Ratificada)

Status: VIGENTE /  2010-09-01

Mechanical standardization of semiconductor devices -- Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (Endorsed by AENOR in September of 2010.)

UNE-EN 62047-6:2010 (Ratificada)

Status: VIGENTE /  2010-06-01

Semiconductor devices - Micro-electromechanical devices -- Part 6: Axial fatigue testing methods of thin film materials (Endorsed by AENOR in June of 2010.)

UNE-EN 60191-6-18:2010 (Ratificada)

Status: VIGENTE /  2010-05-01

Mechanical standardization of semiconductor devices -- Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (Endorsed by AENOR in May of 2010.)

UNE-EN 60191-6:2009 (Ratificada)

Status: VIGENTE /  2010-04-01

Mechanical standardization of semiconductor devices -- Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (Endorsed by AENOR in April of 2010.)

UNE-EN 60749-20-1:2009 (Ratificada)

Status: VIGENTE /  2009-09-01

Semiconductor devices - Mechanical and climatic test methods -- Part 20-1: Handling, packing, labelling and shipping of surface mount devices sensitive to the combined effect of moisture and soldering heat (Endorsed by AENOR in September of 2009.)

UNE-EN 60747-16-3:2002/A1:2009 (Ratificada)

Status: VIGENTE /  2009-07-01

Semiconductor devices -- Part 16-3: Microwave integrated circuits - Frequency converters (Endorsed by AENOR in July of 2009.)

UNE-EN 61967-6:2002/A1:2008 (Ratificada)

Status: VIGENTE /  2008-09-01

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz -- Part 6: Measurement of conducted emissions - Magnetic probe method (Endorsed by AENOR in September of 2008.)

UNE-EN 60749-38:2008 (Ratificada)

Status: VIGENTE /  2008-09-01

Semiconductor devices- Mechanical and climatic test methods- Part 38: Soft error test method for semiconductor devices with memory (Endorsed by AENOR in September of 2008.)

UNE-EN 60749-37:2008 (Ratificada)

Status: VIGENTE /  2008-07-01

Semiconductor devices - Mechanical and climatic test methods -- Part 37: Board level drop test method using an accelerometer (Endorsed by AENOR in July of 2008.)

UNE-EN 60191-6-16:2007 (Ratificada)

Status: VIGENTE /  2007-10-01

Mechanical standardization of semiconductor devices -- Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA (IEC 60191-6-16:2007). (Endorsed by AENOR in October of 2007.)

UNE-EN 60747-16-1:2002/A1:2007 (Ratificada)

Status: VIGENTE /  2007-05-01

Semiconductor devices -- Part 16-1: Microwave integrated circuits - Amplifiers (IEC 60747-16-1:2001/A1:2007). (Endorsed by AENOR in May of 2007.)

UNE-EN 60749-35:2006 (Ratificada)

Status: VIGENTE /  2007-01-01

Semiconductor devices - Mechanical and climatic test methods -- Part 35: Acoustic microscopy for plastic encapsulated electronic components (IEC 60749-35:2006) (Endorsed by AENOR in January of 2007.)

UNE-EN 62047-2:2006 (Ratificada)

Status: VIGENTE /  2007-01-01

Semiconductor devices - Micro-electromechanical devices -- Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006). (Endorsed by AENOR in January of 2007.)

UNE-EN 62047-3:2006 (Ratificada)

Status: VIGENTE /  2007-01-01

Semiconductor devices - Micro-electromechanical devices -- Part 3: Thin film standard test piece for tensile testing (IEC 62047-3:2006) (Endorsed by AENOR in January of 2007.)

UNE-EN 62373:2006 (Ratificada)

Status: VIGENTE /  2006-11-01

Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET) (IEC 62373:2006). (Endorsed by AENOR in November of 2006.)

UNE-EN 60749-27:2006 (Ratificada)

Status: VIGENTE /  2006-11-01

Semiconductor devices - Mechanical and climatic test methods -- Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 60749-27:2006) (Endorsed by AENOR in November of 2006.)

UNE-EN 62132-4:2006 (Ratificada)

Status: VIGENTE /  2006-08-01

Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz -- Part 4: Direct RF power injection method (IEC 62132-4:2006) (Endorsed by AENOR in August of 2006.)

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