IEC 60749-8:2002

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 8: Etanchéité

Date:

2002-08-30 /Vigente

Summary (English):

Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices. The contents of the corrigenda of April 2003 and August 2003 have been included in this copy.

Summary (French):

Relaciones con otras normas IEC

Es modificada por: IEC 60749-8:2002/COR2:2003
Es modificada por: IEC 60749-8:2002/COR1:2003

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