IEC 60749-14:2003

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 14: Robustesse des sorties (integrité des connexions)

Date:

2003-08-07 /Vigente

Summary (English):

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Summary (French):

Relaciones con otras normas IEC

Anula a: IEC PAS 62184:2000

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