IEC PAS 62184:2000

Lead integrity test method

Date:

2003-08-07 /Anulada

Summary (English):

Provides various tests for determining the integrity lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for reassembly.

Summary (French):

Relaciones con otras normas IEC

Es anulada por: IEC 60749-14:2003

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