IEC PAS 60191-6-19:2008

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

Date:

2010-02-25 /Anulada

Summary (English):

This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.

Summary (French):

Relaciones con otras normas IEC

Es anulada por: IEC 60191-6-19:2010

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