IEC 60191-6-19:2010

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Normalisation mécanique des dispositifs à semiconducteurs - Partie 6-19: Méthodes de mesure du gauchissement des boîtiers à température élevée et du gauchissement maximum admissible

Date:

2010-02-25 /Vigente

Summary (English):

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

Summary (French):

Relaciones con otras normas IEC

Anula a: IEC PAS 60191-6-19:2008

Buy on AENOR

This standard is available in:

Digital format

Bilingue