Committee

Committee:

CTN 209/SC 47 - Semiconductor devices

Secretary:
UNE - ASOCIACIÓN ESPAÑOLA DE NORMALIZACIÓN
International Relations:

IEC/TC 47  Semiconductor devices

CLC/TC 47X  Semiconductors and Trusted Chips Implementation

Standards developed by the committee: CTN 209/SC 47: 299

UNE-EN 60749-29:2011 (Ratificada)

Status: VIGENTE /  2011-11-01

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test (Endorsed by AENOR in November of 2011.)

UNE-EN 60749-40:2011 (Ratificada)

Status: VIGENTE /  2011-11-01

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge (Endorsed by AENOR in November of 2011.)

UNE-EN 62047-5:2011 (Ratificada)

Status: VIGENTE /  2011-11-01

Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (Endorsed by AENOR in November of 2011.)

UNE-EN 62047-7:2011 (Ratificada)

Status: VIGENTE /  2011-11-01

Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (Endorsed by AENOR in November of 2011.)

UNE-EN 60749-21:2011 (Ratificada)

Status: VIGENTE /  2011-11-01

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (Endorsed by AENOR in November of 2011.)

UNE-EN 60191-6-12:2011 (Ratificada)

Status: VIGENTE /  2011-11-01

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (Endorsed by AENOR in November of 2011.)

UNE-EN 62258-2:2011 (Ratificada)

Status: VIGENTE /  2011-10-01

Semiconductor die products - Part 2: Exchange data formats (Endorsed by AENOR in October of 2011.)

UNE-EN 62047-8:2011 (Ratificada)

Status: VIGENTE /  2011-09-01

Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (Endorsed by AENOR in September of 2011.)

UNE-EN 60191-6-17:2011 (Ratificada)

Status: VIGENTE /  2011-09-01

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA) (Endorsed by AENOR in September of 2011.)

UNE-EN 60749-34:2011

Status: VIGENTE /  2011-07-20

Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling

UNE-EN 62132-2:2011 (Ratificada)

Status: VIGENTE /  2011-07-01

Integrated circuits - Measurement of electromagnetic immunity -- Part 2: Measurement of radiated immunity - TEM cell and wideband TEM cell method (Endorsed by AENOR in July of 2011.)

UNE-EN 60747-16-4:2004/A1:2011 (Ratificada)

Status: VIGENTE /  2011-04-01

Semiconductor devices -- Part 16-4: Microwave integrated circuits - Switches (Endorsed by AENOR in April of 2011.)

UNE-EN 62374-1:2010 (Ratificada)

Status: VIGENTE /  2011-03-01

Semiconductor devices -- Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (Endorsed by AENOR in March of 2011.)

UNE-EN 62047-4:2010 (Ratificada)

Status: VIGENTE /  2011-02-01

Semiconductor devices - Micro-electromechanical devices -- Part 4: Generic specification for MEMS (Endorsed by AENOR in February of 2011.)

UNE-EN 60191-6-20:2010 (Ratificada)

Status: VIGENTE /  2011-02-01

Mechanical standardization of semiconductor devices -- Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (Endorsed by AENOR in February of 2011.)

UNE-EN 60191-6-21:2010 (Ratificada)

Status: VIGENTE /  2011-02-01

Mechanical standardization of semiconductor devices -- Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (Endorsed by AENOR in February of 2011.)

UNE-EN 62258-1:2010 (Ratificada)

Status: VIGENTE /  2011-02-01

Semiconductor die products -- Part 1: Procurement and use (Endorsed by AENOR in February of 2011.)

UNE-EN 60749-19:2003/A1:2011

Status: VIGENTE /  2011-01-19

Semiconductor devices - Mechanical and climatic test methods -- Part 19: Die shear strength

UNE-EN 60749-32:2004/A1:2011

Status: VIGENTE /  2011-01-19

Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)

UNE-EN 62418:2010 (Ratificada)

Status: VIGENTE /  2010-10-01

Semiconductor devices - Metallization stress void test (Endorsed by AENOR in October of 2010.)

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