Committee

Committee:

CTN 209/SC 47 - Semiconductor devices

Secretary:
UNE - ASOCIACIÓN ESPAÑOLA DE NORMALIZACIÓN
International Relations:

IEC/TC 47  Semiconductor devices

CLC/TC 47X  Semiconductors and Trusted Chips Implementation

Standards developed by the committee: CTN 209/SC 47: 299

UNE-EN 62047-21:2014 (Ratificada)

Status: VIGENTE /  2014-11-01

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials (Endorsed by AENOR in November of 2014.)

UNE-EN 62047-22:2014 (Ratificada)

Status: VIGENTE /  2014-11-01

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (Endorsed by AENOR in November of 2014.)

UNE-EN 60191-4:2014 (Ratificada)

Status: VIGENTE /  2014-05-01

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (Endorsed by AENOR in May of 2014.)

UNE-EN 62215-3:2013 (Ratificada)

Status: VIGENTE /  2013-11-01

Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method (Endorsed by AENOR in November of 2013.)

UNE-EN 62047-11:2013 (Ratificada)

Status: VIGENTE /  2013-11-01

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (Endorsed by AENOR in November of 2013.)

UNE-EN 62047-18:2013 (Ratificada)

Status: VIGENTE /  2013-11-01

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (Endorsed by AENOR in November of 2013.)

UNE-EN 62047-19:2013 (Ratificada)

Status: VIGENTE /  2013-11-01

Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (Endorsed by AENOR in November of 2013.)

UNE-EN 60747-16-5:2013 (Ratificada)

Status: VIGENTE /  2013-10-01

Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (Endorsed by AENOR in October of 2013.)

UNE-EN 60191-6-22:2013 (Ratificada)

Status: VIGENTE /  2013-04-01

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (Endorsed by AENOR in April of 2013.)

UNE-EN 60749-27:2006/A1:2012 (Ratificada)

Status: VIGENTE /  2013-01-01

Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (Endorsed by AENOR in January of 2013.)

UNE-EN 62132-8:2012 (Ratificada)

Status: VIGENTE /  2012-11-01

Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method (Endorsed by AENOR in November of 2012.)

UNE-EN 60747-15:2012 (Ratificada)

Status: VIGENTE /  2012-06-01

Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices (Endorsed by AENOR in June of 2012.)

UNE-EN 62047-13:2012 (Ratificada)

Status: VIGENTE /  2012-06-01

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (Endorsed by AENOR in June of 2012.)

UNE-EN 62047-14:2012 (Ratificada)

Status: VIGENTE /  2012-06-01

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (Endorsed by AENOR in June of 2012.)

UNE-EN 62047-9:2011 (Ratificada)

Status: VIGENTE /  2012-06-01

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)

UNE-EN 62047-12:2011 (Ratificada)

Status: VIGENTE /  2012-02-01

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (Endorsed by AENOR in February of 2012.)

UNE-EN 61967-8:2011 (Ratificada)

Status: VIGENTE /  2012-01-01

Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method (Endorsed by AENOR in January of 2012.)

UNE-EN 60749-23:2005/A1:2011

Status: VIGENTE /  2011-12-21

Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life

UNE-EN 60749-7:2011 (Ratificada)

Status: VIGENTE /  2011-12-01

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases (Endorsed by AENOR in December of 2011.)

UNE-EN 62047-10:2011 (Ratificada)

Status: VIGENTE /  2011-12-01

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (Endorsed by AENOR in December of 2011.)

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