Home>Encuentra tu norma>Comités Técnicos de Normalización>Comité
Committee

Committee:

CTN 203/SC 91-119 - Electronics assembly technology and printed electronics

Secretary:
SERCOBE - ASOCIACIÓN NACIONAL DE FABRICANTES DE BIENES DE EQUIPO
International Relations:

IEC/TC 91  Electronics assembly technology

IEC/TC 119  Printed Electronics

CLC/SR 91  Electronics assembly technology

CLC/SR 119  Printed electronics

Standards developed by the committee: CTN 203/SC 91-119: 311

UNE-EN IEC 62878-2-603:2025 (Ratificada)

Status: VIGENTE / 2025-05-01

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (Endorsed by Asociación Española de Normalización in May of 2025.)

UNE-EN IEC 61189-2-809:2025 (Ratificada)

Status: VIGENTE / 2025-03-01

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA (Endorsed by Asociación Española de Normalización in March of 2025.)

UNE-EN IEC 61188-6-3:2025 (Ratificada)

Status: VIGENTE / 2025-03-01

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (Endorsed by Asociación Española de Normalización in March of 2025.)

UNE-EN IEC 61189-2-805:2024 (Ratificada)

Status: VIGENTE / 2024-07-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA (Endorsed by Asociación Española de Normalización in July of 2024.)

UNE-EN IEC 61189-2-808:2024 (Ratificada)

Status: VIGENTE / 2024-07-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (Endorsed by Asociación Española de Normalización in July of 2024.)

UNE-EN IEC 61189-2-720:2024 (Ratificada)

Status: VIGENTE / 2024-06-01

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (Endorsed by Asociación Española de Normalización in June of 2024.)

UNE-EN IEC 63251:2023 (Ratificada)

Status: VIGENTE / 2024-01-01

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress (Endorsed by Asociación Española de Normalización in January of 2024.)

UNE-EN IEC 63215-2:2023 (Ratificada)

Status: VIGENTE / 2024-01-01

Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices (Endorsed by Asociación Española de Normalización in January of 2024.)

UNE-EN IEC 61189-2-804:2023 (Ratificada)

Status: VIGENTE / 2023-11-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (Endorsed by Asociación Española de Normalización in November of 2023.)

UNE-EN IEC 61189-2-801:2023 (Ratificada)

Status: VIGENTE / 2023-10-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (Endorsed by Asociación Española de Normalización in October of 2023.)

UNE-EN IEC 61189-2-803:2023 (Ratificada)

Status: VIGENTE / 2023-10-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (Endorsed by Asociación Española de Normalización in October of 2023.)

UNE-EN IEC 61249-6-3:2023 (Ratificada)

Status: VIGENTE / 2023-09-01

Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards (Endorsed by Asociación Española de Normalización in September of 2023.)

UNE-EN IEC 61249-2-51:2023 (Ratificada)

Status: VIGENTE / 2023-07-01

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad (Endorsed by Asociación Española de Normalización in July of 2023.)

UNE-EN IEC 61189-2-501:2022 (Ratificada)

Status: VIGENTE / 2022-04-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (Endorsed by Asociación Española de Normalización in April of 2022.)

UNE-EN IEC 61189-2-807:2021 (Ratificada)

Status: VIGENTE / 2021-11-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA (Endorsed by Asociación Española de Normalización in November of 2021.)

UNE-EN IEC 60068-2-21:2021 (Ratificada)

Status: VIGENTE / 2021-10-01

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices (Endorsed by Asociación Española de Normalización in October of 2021.)

UNE-EN IEC 62878-2-602:2021 (Ratificada)

Status: VIGENTE / 2021-10-01

Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (Endorsed by Asociación Española de Normalización in October of 2021.)

UNE-EN IEC 61760-2:2021 (Ratificada)

Status: VIGENTE / 2021-10-01

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (Endorsed by Asociación Española de Normalización in October of 2021.)

UNE-EN IEC 60068-2-20:2021 (Ratificada)

Status: VIGENTE / 2021-06-01

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads (Endorsed by Asociación Española de Normalización in June of 2021.)

UNE-EN IEC 61189-5-301:2021 (Ratificada)

Status: VIGENTE / 2021-06-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (Endorsed by Asociación Española de Normalización in June of 2021.)

Back to results New Search

AENORmás

Design your own personalised collection of standards. Keep your standards updated.