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UNE-EN IEC 62878-2-603:2025 UNE
Status: Vigente/ 2025-05-01
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (Endorsed by Asociación Española de Normalización in May of 2025.)
UNE-EN IEC 61188-6-3:2025 UNE
Status: Vigente/ 2025-03-01
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (Endorsed by Asociación Española de Normalización in March of 2025.)
UNE-EN IEC 61189-2-809:2025 UNE
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA (Endorsed by Asociación Española de Normalización in March of 2025.)
UNE-EN IEC 61189-2-805:2024 UNE
Status: Vigente/ 2024-07-01
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA (Endorsed by Asociación Española de Normalización in July of 2024.)
UNE-EN IEC 61189-2-808:2024 UNE
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (Endorsed by Asociación Española de Normalización in July of 2024.)
UNE-EN IEC 61189-2-720:2024 UNE
Status: Vigente/ 2024-06-01
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (Endorsed by Asociación Española de Normalización in June of 2024.)
UNE-EN IEC 63215-2:2023 UNE
Status: Vigente/ 2024-01-01
Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices (Endorsed by Asociación Española de Normalización in January of 2024.)
UNE-EN IEC 63251:2023 UNE
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress (Endorsed by Asociación Española de Normalización in January of 2024.)
UNE-EN IEC 61189-2-804:2023 UNE
Status: Vigente/ 2023-11-01
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (Endorsed by Asociación Española de Normalización in November of 2023.)
UNE-EN IEC 61189-2-801:2023 UNE
Status: Vigente/ 2023-10-01
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (Endorsed by Asociación Española de Normalización in October of 2023.)
UNE-EN IEC 61189-2-803:2023 UNE
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (Endorsed by Asociación Española de Normalización in October of 2023.)
UNE-EN IEC 61249-6-3:2023 UNE
Status: Vigente/ 2023-09-01
Materials for printed boards and other interconnecting structures - Part 6-3: Sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards (Endorsed by Asociación Española de Normalización in September of 2023.)
UNE-EN IEC 61249-2-51:2023 UNE
Status: Vigente/ 2023-07-01
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for Integrated Circuit card carrier tape, unclad (Endorsed by Asociación Española de Normalización in July of 2023.)
UNE-EN IEC 61189-2-501:2022 UNE
Status: Vigente/ 2022-04-01
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (Endorsed by Asociación Española de Normalización in April of 2022.)
UNE-EN IEC 61189-2-807:2021 UNE
Status: Vigente/ 2021-11-01
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA (Endorsed by Asociación Española de Normalización in November of 2021.)
UNE-EN IEC 60068-2-21:2021 UNE
Status: Vigente/ 2021-10-01
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices (Endorsed by Asociación Española de Normalización in October of 2021.)
UNE-EN IEC 62878-2-602:2021 UNE
Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (Endorsed by Asociación Española de Normalización in October of 2021.)
UNE-EN IEC 61760-2:2021 UNE
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (Endorsed by Asociación Española de Normalización in October of 2021.)
UNE-EN IEC 61189-5-301:2021 UNE
Status: Vigente/ 2021-06-01
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (Endorsed by Asociación Española de Normalización in June of 2021.)
UNE-EN IEC 60068-2-20:2021 UNE
Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads (Endorsed by Asociación Española de Normalización in June of 2021.)
UNE-EN IEC 61188-6-1:2021 UNE
Status: Vigente/ 2021-05-01
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Española de Normalización in May of 2021.)
UNE-EN IEC 61760-3:2021 UNE
Status: Vigente/ 2021-04-01
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (Endorsed by Asociación Española de Normalización in April of 2021.)
UNE-EN IEC 61189-5-502:2021 UNE
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (Endorsed by Asociación Española de Normalización in April of 2021.)
UNE-EN IEC 61189-5-601:2021 UNE
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (Endorsed by Asociación Española de Normalización in April of 2021.)
UNE-EN IEC 61188-6-2:2021 UNE
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (Endorsed by Asociación Española de Normalización in April of 2021.)
UNE-EN IEC 61189-5-501:2021 UNE
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (Endorsed by Asociación Española de Normalización in April of 2021.)
UNE-EN IEC 61760-1:2020 UNE
Status: Vigente/ 2020-11-01
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (Endorsed by Asociación Española de Normalización in November of 2020.)
UNE-EN IEC 61189-5-504:2020 UNE
Status: Vigente/ 2020-07-01
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (Endorsed by Asociación Española de Normalización in July of 2020.)
UNE-EN IEC 62878-1:2019 UNE
Status: Vigente/ 2020-01-01
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (Endorsed by Asociación Española de Normalización in January of 2020.)
UNE-EN IEC 62878-2-5:2019 UNE
Status: Vigente/ 2019-12-01
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (Endorsed by Asociación Española de Normalización in December of 2019.)
UNE-EN 61191-2:2017/AC:2019-10 UNE
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2019.)
UNE-EN 60068-2-69:2017/A1:2019 UNE
Status: Vigente/ 2019-10-01
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Endorsed by Asociación Española de Normalización in October of 2019.)
UNE-EN IEC 60068-2-82:2019 UNE
Status: Vigente/ 2019-08-01
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for components and parts used in electronic assemblies (Endorsed by Asociación Española de Normalización in August of 2019.)
UNE-EN IEC 61188-6-4:2019 UNE
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (Endorsed by Asociación Española de Normalización in August of 2019.)
UNE-EN IEC 61191-1:2018 UNE
Status: Vigente/ 2018-12-01
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (Endorsed by Asociación Española de Normalización in December of 2018.)
UNE-EN IEC 61189-2-630:2018 UNE
Status: Vigente/ 2018-11-01
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (Endorsed by Asociación Española de Normalización in November of 2018.)
UNE-EN 61760-4:2015/A1:2018 UNE
Status: Vigente/ 2018-06-01
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (Endorsed by Asociación Española de Normalización in June of 2018.)
UNE-EN IEC 61249-2-47:2018 UNE
Status: Vigente/ 2018-05-01
Materials for printed boards and other interconnecting structures – Part 2-47: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2.0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
UNE-EN IEC 61249-2-45:2018 UNE
Materials for printed boards and other interconnecting structures – Part 2-45: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
UNE-EN IEC 61249-2-46:2018 UNE
Materials for printed boards and other interconnecting structures – Part 2-46: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
UNE-EN 60068-2-58:2015/A1:2018 UNE
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by Asociación Española de Normalización in May of 2018.)
UNE-EN IEC 61190-1-3:2018 UNE
Status: Vigente/ 2018-04-01
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (Endorsed by Asociación Española de Normalización in April of 2018.)
UNE-EN 60068-2-69:2017/AC:2018-03 UNE
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Endorsed by Asociación Española de Normalización in April of 2018.)
UNE-EN 61191-4:2017 UNE
Status: Vigente/ 2017-12-01
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2017.)
UNE-EN 61191-2:2017 UNE
Status: Vigente/ 2017-11-01
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in November of 2017.)
UNE-EN 61191-3:2017 UNE
Status: Vigente/ 2017-10-01
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)
UNE-EN 61189-5-503:2017 UNE
Status: Vigente/ 2017-09-01
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (Endorsed by Asociación Española de Normalización in September of 2017.)
UNE-EN 61188-7:2017 UNE
Status: Vigente/ 2017-08-01
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (Endorsed by Asociación Española de Normalización in August of 2017.)
UNE-EN 62090:2017 UNE
Product package labels for electronic components using bar code and two- dimensional symbologies (Endorsed by Asociación Española de Normalización in August of 2017.)
UNE-EN 60068-2-69:2017 UNE
Status: Vigente/ 2017-07-01
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Endorsed by Asociación Española de Normalización in July of 2017.)
