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IEC 61189-3:1997

IEC 61189-3:1997

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Méthodes d'essai pour les matériaux électriques, les structures d'interconnexion et les ensembles - Partie 3: Méthodes d'essai des structures d'interconnexion (cartes imprimées)

Date:
2007-10-09 /Anulada
Summary (English):
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers chemical, mechanical and electrical test methods.
Summary (French):
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