IEC 60191-4:2013

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Normalisation mécanique des dispositifs à semiconducteurs - Partie 4: Système de codification et classification en formes des structures des boîtiers pour dispositifs à semiconducteurs

Date:

2013-10-10 /Vigente

Summary (English):

IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition: a) Material code "S" is added to indicate a silicon based package. b) Description of "WL" is added to be used for general use.

Summary (French):

Relaciones con otras normas IEC

Es modificada por: IEC 60191-4:2013/AMD1:2018
Anula a: IEC 60191-4:1999/AMD2:2002
Anula a: IEC 60191-4:1999+AMD1:2001+AMD2:2002 CSV
Anula a: IEC 60191-4:1999/AMD1:2001
Anula a: IEC 60191-4:1999

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