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Standard
IEC 61189-2/AMD1/FRAG18 ED1

IEC 61189-2/AMD1/FRAG18 ED1

Test methods for materials for interconnection structures - Test M27: Resin flow properties of coverlay films, bonding films and adhesive cast films used in the fabrication of flexible printed wiring boards

Date:
1995-07-07 /Anulada
Summary (English):
Summary (French):
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