IEC 62418:2010

Semiconductor devices - Metallization stress void test

Dispositifs à semiconducteurs - Essai sur les cavités dues aux contraintes de la métallisation

Date:

2010-04-22 /Vigente

Summary (English):

IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

Summary (French):

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