IEC 62374-1:2010

Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

Dispositifs à semiconducteurs - Partie 1: Essai de rupture diélectrique en fonction du temps (TDDB) pour les couches intermétalliques

Date:

2010-09-29 /Vigente

Summary (English):

IEC 62374-1:2010 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.

Summary (French):

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