IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 2-801: Essai de conductivité thermique pour matériaux de base

Date:

2023-07-26 /Vigente

Summary (English):

IEC 61189-2-801:2023 defines a test method to be followed for thermal performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.

Summary (French):

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