IEC 61837-1:2012

Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 1: Plastic moulded enclosure outlines

Dispositifs piézoélectriques à montage en surface pour la commande et le choix de la fréquence - Encombrements normalisés et connexions des sorties - Partie 1: Encombrements des enveloppes en plastique moulées

Date:

2012-04-20 /Vigente

Summary (English):

IEC 61837-1:2012 deals with standard outlines and terminal lead connections as they apply to SMDs for frequency control and selection in plastic moulded enclosures and is based on IEC 61240. This publication is to be read in conjunction with IEC 61240:1994.

Summary (French):

Relaciones con otras normas IEC

Anula a: IEC 61837-1:1999

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