IEC 61249-8-8:1997

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

Matériaux pour les structures d'interconnexion - Partie 8: Collection de spécification intermédiaires pour les films et revêtements non conducteurs - Section 8: Revêtements amovibles de polymère

Date:

1997-06-24 /Vigente

Summary (English):

Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.

Summary (French):

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