IEC 61190-1-1:2002

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Matériaux de fixation pour les assemblages électroniques - Partie 1-1: Exigences relatives aux flux de brasage pour les interconnexions de haute qualité dans les assemblages de composants électroniques

Date:

2002-03-25 /Vigente

Summary (English):

Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.

Summary (French):

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This standard is available in:

Digital format

Bilingue