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IEC 61189-1:1997

IEC 61189-1:1997

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

Méthodes d'essais pour les matériaux électriques, les structures d'interconnexion et les ensembles - Partie 1: Méthodes d'essai générales et méthodologie

Date:
1997-03-27 /Vigente
Summary (English):
This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.
Summary (French):
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