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IEC 60749-9:2002

IEC 60749-9:2002

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 9: Permanence du marquage

Date:
2017-03-03 /Anulada
Summary (English):
Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive. The contents of the corrigendum of August 2003 have been included in this copy.
Summary (French):
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