IEC PAS 62137-3:2008

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints

Date:

2011-11-08 /Anulada

Summary (English):

IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.

Summary (French):

Relaciones con otras normas IEC

Es anulada por: IEC 62137-3:2011

Buy on AENOR

This standard is available in:

Digital format

Ingles