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IEC 60749-34:2004

IEC 60749-34:2004

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 34: Cycles en puissance

Date:
2010-10-28 /Anulada
Summary (English):
Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.
Summary (French):
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