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IEC 60749-20:2002

IEC 60749-20:2002

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 20: Résistance des CMS à boîtier plastique à l'effet combiné de l'humidité et de la chaleur de soudage

Date:
2008-12-09 /Anulada
Summary (English):
Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices. The contents of the corrigendum of August 2003 have been included in this copy.
Summary (French):
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