IEC 60068-2-58:1989

Environmental testing. Part 2: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)

Essais d'environnement. Deuxième partie: Essais. Essai Td: Soudabilité, résistance de la métallisation à la dissolution et résistance à la chaleur de soudage des composants pour montage en surface (CMS)

Date:

1999-01-15 /Anulada

Summary (English):

Determines solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices. The procedure uses a solder bath and applies only to products designed to withstand short-term immersion in molten solder.

Summary (French):

Relaciones con otras normas IEC

Es anulada por: IEC 60068-2-58:1999

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