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UNE-EN IEC 62878-2-603:2025 UNE
Status: Vigente/ 2025-05-01
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity (Endorsed by Asociación Española de Normalización in May of 2025.)
UNE-EN IEC 61188-6-3:2025 UNE
Status: Vigente/ 2025-03-01
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (Endorsed by Asociación Española de Normalización in March of 2025.)
UNE-EN IEC 63215-2:2023 UNE
Status: Vigente/ 2024-01-01
Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices (Endorsed by Asociación Española de Normalización in January of 2024.)
UNE-EN IEC 60068-2-21:2021 UNE
Status: Vigente/ 2021-10-01
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices (Endorsed by Asociación Española de Normalización in October of 2021.)
UNE-EN IEC 62878-2-602:2021 UNE
Device Embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (Endorsed by Asociación Española de Normalización in October of 2021.)
UNE-EN IEC 61188-6-1:2021 UNE
Status: Vigente/ 2021-05-01
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Española de Normalización in May of 2021.)
UNE-EN IEC 61760-3:2021 UNE
Status: Vigente/ 2021-04-01
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (Endorsed by Asociación Española de Normalización in April of 2021.)
UNE-EN IEC 61188-6-2:2021 UNE
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (Endorsed by Asociación Española de Normalización in April of 2021.)
UNE-EN IEC 62878-1:2019 UNE
Status: Vigente/ 2020-01-01
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (Endorsed by Asociación Española de Normalización in January of 2020.)
UNE-EN IEC 62878-2-5:2019 UNE
Status: Vigente/ 2019-12-01
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (Endorsed by Asociación Española de Normalización in December of 2019.)
UNE-EN 61191-2:2017/AC:2019-10 UNE
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2019.)
UNE-EN 60068-2-69:2017/A1:2019 UNE
Status: Vigente/ 2019-10-01
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Endorsed by Asociación Española de Normalización in October of 2019.)
UNE-EN IEC 60068-2-82:2019 UNE
Status: Vigente/ 2019-08-01
Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for components and parts used in electronic assemblies (Endorsed by Asociación Española de Normalización in August of 2019.)
UNE-EN IEC 61191-1:2018 UNE
Status: Vigente/ 2018-12-01
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (Endorsed by Asociación Española de Normalización in December of 2018.)
UNE-EN 61760-4:2015/A1:2018 UNE
Status: Vigente/ 2018-06-01
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (Endorsed by Asociación Española de Normalización in June of 2018.)
UNE-EN 60068-2-58:2015/A1:2018 UNE
Status: Vigente/ 2018-05-01
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by Asociación Española de Normalización in May of 2018.)
UNE-EN IEC 61190-1-3:2018 UNE
Status: Vigente/ 2018-04-01
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (Endorsed by Asociación Española de Normalización in April of 2018.)
UNE-EN 60068-2-69:2017/AC:2018-03 UNE
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Endorsed by Asociación Española de Normalización in April of 2018.)
UNE-EN 61191-2:2017 UNE
Status: Vigente/ 2017-11-01
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in November of 2017.)
UNE-EN 62090:2017 UNE
Status: Vigente/ 2017-08-01
Product package labels for electronic components using bar code and two- dimensional symbologies (Endorsed by Asociación Española de Normalización in August of 2017.)
UNE-EN 60068-2-69:2017 UNE
Status: Vigente/ 2017-07-01
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Endorsed by Asociación Española de Normalización in July of 2017.)
UNE-EN 62739-3:2017 UNE
Status: Vigente/ 2017-05-01
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods (Endorsed by Asociación Española de Normalización in May of 2017.)
UNE-EN 62739-2:2016 UNE
Status: Vigente/ 2016-11-01
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing (Endorsed by AENOR in November of 2016.)
UNE-EN 61760-4:2015 UNE
Status: Vigente/ 2015-08-01
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (Endorsed by AENOR in August of 2015.)
UNE-EN 62878-1-1:2015 UNE
Device embedded substrate - Part 1-1: Generic specification - Test methods (Endorsed by AENOR in August of 2015.)
UNE-EN 60068-2-58:2015 UNE
Status: Vigente/ 2015-06-01
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by AENOR in June of 2015.)
UNE-EN 62137-4:2014/AC:2015 UNE
Status: Vigente/ 2015-03-01
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (Endorsed by AENOR in March of 2015.)
UNE-EN 62137-4:2014 UNE
Status: Vigente/ 2015-02-01
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (Endorsed by AENOR in February of 2015.)
UNE-EN 61190-1-2:2014 UNE
Status: Vigente/ 2014-07-01
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (Endorsed by AENOR in July of 2014.)
UNE-EN 62739-1:2013 UNE
Status: Vigente/ 2013-10-01
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (Endorsed by AENOR in October of 2013.)
UNE-EN 61193-3:2013 UNE
Status: Vigente/ 2013-06-01
Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (Endorsed by AENOR in June of 2013.)
UNE-EN 62137-3:2012 UNE
Status: Vigente/ 2012-04-01
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (Endorsed by AENOR in April of 2012.)
UNE-EN 62137-1-5:2009 UNE
Status: Vigente/ 2009-08-01
Surface mounting technology - Environmental and endurance test methods for surface mount solder joints -- Part 1-5: Mechanical shear fatigue test (Endorsed by AENOR in August of 2009.)
UNE-EN 62137-1-3:2009 UNE
Status: Vigente/ 2009-05-01
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-3: Cyclic drop test (Endorsed by AENOR in May of 2009.)
UNE-EN 62137-1-4:2009 UNE
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-4: Cyclic bending test (Endorsed by AENOR in May of 2009.)
UNE-EN 62421:2007 UNE
Status: Vigente/ 2008-03-01
Electronics assembly technology - Electronic modules (IEC 62421:2007). (Endorsed by AENOR in March of 2008.)
UNE-EN 61193-2:2007 UNE
Quality assessment systems -- Part 2: Selection and use of sampling plans for inspection of electronic components and packages (IEC 61193-2:2007). (Endorsed by AENOR in March of 2008.)
UNE-EN 62137-1-1:2007 UNE
Status: Vigente/ 2007-12-01
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-1: Pull strength test (IEC 62137-1-1:2007). (Endorsed by AENOR in December of 2007.)
UNE-EN 62137-1-2:2007 UNE
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint -- Part 1-2: Shear strength test (IEC 62137-1-2:2007). (Endorsed by AENOR in December of 2007.)
UNE-EN 60939-2-1:2004 UNE
Status: Vigente/ 2005-04-01
Complete filter units for radio interference suppression -- Part 2-1: Blank detail specification - Passive filter units for electromagnetic interference suppression - Filters for which safety tests are required (assessment level D/DZ) (Endorsed by AENOR in April of 2005.)
UNE-EN 61188-5-2:2003 UNE
Status: Vigente/ 2004-01-01
Printed boards and printed board assemblies - Design and use -- Part 5-2: Attachment (land/joint) considerations - Discrete components (Endorsed by AENOR in January of 2004.)
UNE-EN 61188-5-6:2003 UNE
Status: Vigente/ 2003-07-01
Printed boards and printed board assemblies - Design and use -- Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides (Endorsed by AENOR in July of 2003.)
UNE-EN 61190-1-1:2002 UNE
Status: Vigente/ 2002-11-01
Attachment materials for electronic assembly -- Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (Endorsed by AENOR in November of 2002.)
UNE-EN 61193-1:2002 UNE
Status: Vigente/ 2002-07-01
Quality assessment systems -- Part 1: Registration and analysis of defects on printed board assemblies (Endorsed by AENOR in July of 2002.)
PNE-prEN IEC 61760-4:2025 PROY
Status: Procedure
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
PNE-prEN IEC 60068-2-83 PROY
Environmental testing - Part 2-83: Tests - Test tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
PNE-prEN IEC 60068-2-88:2024 PROY
Environmental testing - Part 2-88: Tests – Test XD: Resistance of components and assemblies to liquid cleaning media
PNE-prEN IEC 63215-5:2022 PROY
Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices
UNE-EN 61191-1:2013 UNE
Status: Anulada/ 2021-10-20
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (Endorsed by AENOR in October of 2013.)
UNE-EN 61190-1-3:2007 UNE
Status: Anulada/ 2021-01-18
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
