Committee

Committee:

CTN 209/SC 47 - Semiconductor devices

Secretary:
UNE - ASOCIACIÓN ESPAÑOLA DE NORMALIZACIÓN
International Relations:

IEC/TC 47  Semiconductor devices

CLC/TC 47X  Semiconductors and Trusted Chips Implementation

Standards developed by the committee: CTN 209/SC 47: 299

UNE-EN 62433-3:2017 (Ratificada)

Status: VIGENTE /  2017-07-01

EMC IC modelling - Part 3: Models of Integrated Circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE) (Endorsed by Asociación Española de Normalización in July of 2017.)

UNE-EN 62433-2:2017 (Ratificada)

Status: VIGENTE /  2017-06-01

EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE) (Endorsed by Asociación Española de Normalización in June of 2017.)

UNE-EN 62435-1:2017 (Ratificada)

Status: VIGENTE /  2017-06-01

Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General (Endorsed by Asociación Española de Normalización in June of 2017.)

UNE-EN 62435-2:2017 (Ratificada)

Status: VIGENTE /  2017-06-01

Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration Mechanisms (Endorsed by Asociación Española de Normalización in June of 2017.)

UNE-EN 62435-5:2017 (Ratificada)

Status: VIGENTE /  2017-05-01

Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices (Endorsed by Asociación Española de Normalización in May of 2017.)

UNE-EN 62228-2:2017 (Ratificada)

Status: VIGENTE /  2017-03-01

Integrated circuits - EMC Evaluation of transceivers - Part 2: LIN transceivers (Endorsed by Asociación Española de Normalización in March of 2017.)

UNE-EN 62047-25:2016 (Ratificada)

Status: VIGENTE /  2017-01-01

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area (Endorsed by Asociación Española de Normalización in January of 2017.)

UNE-EN 60191-6-13:2016 (Ratificada)

Status: VIGENTE /  2017-01-01

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (Endorsed by Asociación Española de Normalización in January of 2017.)

UNE-EN 60749-44:2016 (Ratificada)

Status: VIGENTE /  2016-12-01

Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices (Endorsed by AENOR in December of 2016.)

UNE-EN 62433-4:2016 (Ratificada)

Status: VIGENTE /  2016-12-01

EMC IC modelling - Part 4: Models of Integrated Circuits for RF Immunity behavioural simulation - Conducted Immunity modelling (ICIM-CI) (Endorsed by AENOR in December of 2016.)

UNE-EN 62779-1:2016 (Ratificada)

Status: VIGENTE /  2016-07-01

Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements (Endorsed by AENOR in July of 2016.)

UNE-EN 62779-2:2016 (Ratificada)

Status: VIGENTE /  2016-07-01

Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances (Endorsed by AENOR in July of 2016.)

UNE-EN 62779-3:2016 (Ratificada)

Status: VIGENTE /  2016-07-01

Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions (Endorsed by AENOR in July of 2016.)

UNE-EN 62047-26:2016 (Ratificada)

Status: VIGENTE /  2016-06-01

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (Endorsed by AENOR in June of 2016.)

UNE-EN 62047-1:2016 (Ratificada)

Status: VIGENTE /  2016-05-01

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions (Endorsed by AENOR in May of 2016.)

UNE-EN 62132-1:2016 (Ratificada)

Status: VIGENTE /  2016-04-01

Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions (Endorsed by AENOR in April of 2016.)

UNE-EN 62047-16:2015 (Ratificada)

Status: VIGENTE /  2015-08-01

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods (Endorsed by AENOR in August of 2015.)

UNE-EN 62047-17:2015 (Ratificada)

Status: VIGENTE /  2015-08-01

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films (Endorsed by AENOR in August of 2015.)

UNE-EN 60749-42:2014 (Ratificada)

Status: VIGENTE /  2014-11-01

Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage (Endorsed by AENOR in November of 2014.)

UNE-EN 62047-20:2014 (Ratificada)

Status: VIGENTE /  2014-11-01

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes (Endorsed by AENOR in November of 2014.)

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