Committee:
IEC/TC 47 Semiconductor devices
CLC/TC 47X Semiconductors and Trusted Chips Implementation
Standards developed by the committee: CTN 209/SC 47: 301
Status: VIGENTE / 1997-11-01
IEC 821 VMEBUS. MICROPROCESSOR SYSTEM BUS FOR 1 BYTE TO 4 BYTE DATA. (Endorsed by AENOR in November of 1997.)
Status: VIGENTE / 1996-09-01
BDS: LIGHT EMITTING DIODES AND INFRARED EMITTING DIODES FOR FIBRE OPTIC SYSTEM OR SUB-SYSTEM. (Endorsed by AENOR in September of 1996.)
BDS: PIN-PHOTODIODES FOR FIBRE OPTIC APPLICATIONS. (Endorsed by AENOR in September of 1996.)
BDS: LIQUID CRISTAL DISPLAYS. MONOCHROME LCDS WITHOUT ELECTRONIC CIRCUIT. (Endorsed by AENOR in September of 1996.)
Status: VIGENTE / 1995-12-01
MICROPROCESSOR SYSTEM BUS. 8 BIT AND 16 BIT DATA (MULTIBUS I). PART 1: FUNCTIONAL DESCRIPTION WITH ELECTRICAL AND TIMING SPECIFICATIONS. (Endorsed by AENOR in December of 1995.)
MICROPROCESSOR SYSTEM BUS. 8 BIT AND 16 BIT DATA (MULTIBUS I). PART 2: MECHANICAL AND PIN DESCRIPTIONS FOR THE SYSTEM BUS CONFIGURATION, WITH EDGE CONNECTORS (DIRECT). (Endorsed by AENOR in December of 1995.)
Status: VIGENTE / 1994-09-23
MICROPOCESSOR SYSTEM BUS I 8-BIT AND 16 BIT DATA. PART 3: MECHANICAL AND PIN DESCRIPTIONS FOR THE EUROCARD CONFIGURATION WITH PIN AND SOCKET (INDIRECT) CONNECTORS.
Status: VIGENTE / 1993-12-29
IEC 822 VSB. PARALLEL SUB-SYSTEM BUS OF THE IEC 821 VMEBUS.
Status: VIGENTE / 1991-09-12
SEMICONDUCTOR DEVICES. PART 11: SECTIONAL SPECIFICATION FOR DISCRETE DEVICES.
Status: VIGENTE / 1978-06-15
LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES AND INTEGRATED MICROCIRCUITS.
Status: ANULADA / 2025-06-02
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
Status: ANULADA / 2025-04-06
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level (Endorsed by Asociación Española de Normalización in August of 2017.)
Status: ANULADA / 2025-01-04
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
Status: ANULADA / 2024-10-10
Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans (Endorsed by Asociación Española de Normalización in October of 2017.)
Status: ANULADA / 2024-04-25
Blank Detail Specification: Ambient rated photocouplers with phototransistor output
Blank Detail Specification: Infrared emitting diodes, infrared emitting diode arrays
Blank Detail Specification: Light emitting diodes, light emitting diode arrays, light emitting diode displays without internal logic and resistor
Blank Detail Specification: Photodiodes, photodiode arrays (not intended for fibre optic applications)
Blank Detail Specification: Phototransistors, photodarlington transistors, phototransistor arrays
Status: ANULADA / 2024-04-21
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method (Endorsed by Asociación Española de Normalización in September of 2017.)
Back to results New Search
Design your own personalised collection of standards. Keep your standards updated.
