Committee

Committee:

CTN 203/SC 91-119 - Electronics assembly technology and printed electronics

Secretary:
SERCOBE - ASOCIACIÓN NACIONAL DE FABRICANTES DE BIENES DE EQUIPO
International Relations:

IEC/TC 91  Electronics assembly technology

IEC/TC 119  Printed Electronics

CLC/SR 91  Electronics assembly technology

CLC/SR 119  Printed electronics

Standards developed by the committee: CTN 203/SC 91-119: 311

UNE-EN 123000/A2:1996 (Ratificada)

Status: VIGENTE /  1998-06-01

GENERIC SPECIFICATION: PRINTED BOARDS. (Endorsed by AENOR in June of 1998.)

UNE-EN 61249-5-4:1997

Status: VIGENTE /  1997-11-05

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH OR WITHOUT COATINGS. SECTION 4: CONDUCTIVE INKS.

UNE-EN 61189-1:1997 (Ratificada)

Status: VIGENTE /  1997-11-01

TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 1: GENERAL TEST METHODS AND METHODOLOGY (Endorsed by AENOR in November of 1997.)

UNE-EN 61182-7:1997

Status: VIGENTE /  1997-10-30

PRINTED BOARDS. ELECTRONIC DATA DESCRIPTION AND TRANSFER. PART 7: BARE BOARD ELECTRIC TEST INFORMATION IN DIGITAL FORM.

UNE-EN 60249-2-18:1997

Status: VIGENTE /  1997-10-17

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICTION Nº 18: BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).

UNE-EN 60249-2-19/A1:1997

Status: VIGENTE /  1997-10-17

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.

UNE-EN 60249-2-19/A2:1997

Status: VIGENTE /  1997-10-17

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.

UNE-EN 61249-8-7:1997

Status: VIGENTE /  1997-10-17

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS. SECTION 7: MARKING LEGEND INKS.

UNE-EN 61249-7-1:1997

Status: VIGENTE /  1997-10-17

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 7: SECTIONAL SPECIFICATION SET FOR RESTRAINING CORE MATERIALS. SECTION 1: COPPER/INVAR/COPPER.

UNE-EN 60249-2-17:1997

Status: VIGENTE /  1997-08-11

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 17: THIN POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARD.

UNE-EN 60249-2-19:1997

Status: VIGENTE /  1997-08-11

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.

UNE-EN 60249-2-16:1997

Status: VIGENTE /  1997-07-15

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 16: POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).

UNE-EN 61249-5-1:1997

Status: VIGENTE /  1997-07-15

MATERIALS FOR INTERCONNECTION STRUCTURES. PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH AND WITHOUT COATINGS. SECTION 1: COPPER FOILS (FOR THE MANUFACTURE OF COPPER-CLAD BASE MATERIALS).

UNE-EN 60249-1:1997

Status: VIGENTE /  1997-02-05

BASE MATERIALS FOR PRINTED CIRCUITS. PART 1: TEST METHODS.

UNE-EN 60249-1/A4:1997

Status: VIGENTE /  1997-02-05

BASE MATERIALS FOR PRINTED CIRCUITS. PART 1: TEST METHODS.

UNE-EN 60249-2-4:1996

Status: VIGENTE /  1996-11-07

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.

UNE-EN 60249-2-4/A3:1996

Status: VIGENTE /  1996-11-07

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.

UNE-EN 60249-2-4/A4:1996

Status: VIGENTE /  1996-11-07

BASE MATERIAL FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.

UNE-EN 160000/A1:1995 (Ratificada)

Status: VIGENTE /  1996-11-01

GENERIC SPECIFICATION: MODULAR ELECTRONIC UNITS (Endorsed by AENOR in November of 1996.)

UNE-EN 60249-2-3/A2:1996

Status: VIGENTE /  1996-10-23

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 3: EPOXIDE CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).

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