Committee

Committee:

CTN 203/SC 91-119 - Electronics assembly technology and printed electronics

Secretary:
SERCOBE - ASOCIACIÓN NACIONAL DE FABRICANTES DE BIENES DE EQUIPO
International Relations:

IEC/TC 91  Electronics assembly technology

IEC/TC 119  Printed Electronics

CLC/SR 91  Electronics assembly technology

CLC/SR 119  Printed electronics

Standards developed by the committee: CTN 203/SC 91-119: 311

UNE-EN 62878-1-1:2015 (Ratificada)

Status: VIGENTE /  2015-08-01

Device embedded substrate - Part 1-1: Generic specification - Test methods (Endorsed by AENOR in August of 2015.)

UNE-EN 61760-4:2015 (Ratificada)

Status: VIGENTE /  2015-08-01

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (Endorsed by AENOR in August of 2015.)

UNE-EN 60068-2-58:2015 (Ratificada)

Status: VIGENTE /  2015-06-01

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by AENOR in June of 2015.)

UNE-EN 61189-5-3:2015 (Ratificada)

Status: VIGENTE /  2015-04-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (Endorsed by AENOR in April of 2015.)

UNE-EN 61189-5-4:2015 (Ratificada)

Status: VIGENTE /  2015-04-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (Endorsed by AENOR in April of 2015.)

UNE-EN 62137-4:2014/AC:2015 (Ratificada)

Status: VIGENTE /  2015-03-01

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (Endorsed by AENOR in March of 2015.)

UNE-EN 62137-4:2014 (Ratificada)

Status: VIGENTE /  2015-02-01

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (Endorsed by AENOR in February of 2015.)

UNE-EN 61190-1-2:2014 (Ratificada)

Status: VIGENTE /  2014-07-01

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (Endorsed by AENOR in July of 2014.)

UNE-EN 61249-4-18:2013 (Ratificada)

Status: VIGENTE /  2014-02-01

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in February of 2014.)

UNE-EN 61249-4-19:2013 (Ratificada)

Status: VIGENTE /  2014-02-01

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Hich performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (Endorsed by AENOR in February of 2014.)

UNE-EN 62739-1:2013 (Ratificada)

Status: VIGENTE /  2013-10-01

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing (Endorsed by AENOR in October of 2013.)

UNE-EN 61189-11:2013 (Ratificada)

Status: VIGENTE /  2013-08-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (Endorsed by AENOR in August of 2013.)

UNE-EN 61193-3:2013 (Ratificada)

Status: VIGENTE /  2013-06-01

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (Endorsed by AENOR in June of 2013.)

UNE-EN 61249-2-27:2013 (Ratificada)

Status: VIGENTE /  2013-05-01

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad (Endorsed by AENOR in May of 2013.)

UNE-EN 61249-2-30:2013 (Ratificada)

Status: VIGENTE /  2013-05-01

Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (Endorsed by AENOR in May of 2013.)

UNE-EN 61249-2-39:2013 (Ratificada)

Status: VIGENTE /  2013-05-01

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in May of 2013.)

UNE-EN 61249-2-40:2013 (Ratificada)

Status: VIGENTE /  2013-05-01

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in May of 2013.)

UNE-EN 62137-3:2012 (Ratificada)

Status: VIGENTE /  2012-04-01

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (Endorsed by AENOR in April of 2012.)

UNE-EN 60068-2-83:2011 (Ratificada)

Status: VIGENTE /  2012-01-01

Environmental testing -- Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (Endorsed by AENOR in January of 2012.)

UNE-EN 61249-2-41:2010 (Ratificada)

Status: VIGENTE /  2010-09-01

Materials for printed boards and other interconnecting structures -- Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in September of 2010.)

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