Committee

Committee:

CTN 203/SC 91-119 - Electronics assembly technology and printed electronics

Secretary:

SERCOBE - ASOCIACIÓN NACIONAL DE FABRICANTES DE BIENES DE EQUIPO

International Relations:

IEC/TC 91 Electronics assembly technology

IEC/TC 119 Printed Electronics

CLC/SR 91 Electronics assembly technology

CLC/SR 119 Printed electronics

Standards developed by the committee: CTN 203/SC 91-119: 313

UNE-EN IEC 61249-2-45:2018 (Ratificada)

Status: VIGENTE / 2018-05-01

Materials for printed boards and other interconnecting structures – Part 2-45: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

UNE-EN IEC 61249-2-46:2018 (Ratificada)

Status: VIGENTE / 2018-05-01

Materials for printed boards and other interconnecting structures – Part 2-46: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

UNE-EN IEC 61249-2-47:2018 (Ratificada)

Status: VIGENTE / 2018-05-01

Materials for printed boards and other interconnecting structures – Part 2-47: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2.0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

UNE-EN 60068-2-69:2017/AC:2018-03 (Ratificada)

Status: VIGENTE / 2018-04-01

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Endorsed by Asociación Española de Normalización in April of 2018.)

UNE-EN IEC 61190-1-3:2018 (Ratificada)

Status: VIGENTE / 2018-04-01

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (Endorsed by Asociación Española de Normalización in April of 2018.)

UNE-EN 61191-4:2017 (Ratificada)

Status: VIGENTE / 2017-12-01

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2017.)

UNE-EN 61191-2:2017 (Ratificada)

Status: VIGENTE / 2017-11-01

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in November of 2017.)

UNE-EN 61191-3:2017 (Ratificada)

Status: VIGENTE / 2017-10-01

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (Endorsed by Asociación Española de Normalización in October of 2017.)

UNE-EN 61189-5-503:2017 (Ratificada)

Status: VIGENTE / 2017-09-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (Endorsed by Asociación Española de Normalización in September of 2017.)

UNE-EN 62090:2017 (Ratificada)

Status: VIGENTE / 2017-08-01

Product package labels for electronic components using bar code and two- dimensional symbologies (Endorsed by Asociación Española de Normalización in August of 2017.)

UNE-EN 61188-7:2017 (Ratificada)

Status: VIGENTE / 2017-08-01

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (Endorsed by Asociación Española de Normalización in August of 2017.)

UNE-EN 60068-2-69:2017 (Ratificada)

Status: VIGENTE / 2017-07-01

UNE-EN 62739-3:2017 (Ratificada)

Status: VIGENTE / 2017-05-01

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods (Endorsed by Asociación Española de Normalización in May of 2017.)

UNE-EN 62739-2:2016 (Ratificada)

Status: VIGENTE / 2016-11-01

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing (Endorsed by AENOR in November of 2016.)

UNE-EN 61189-5-1:2016 (Ratificada)

Status: VIGENTE / 2016-11-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (Endorsed by AENOR in November of 2016.)

UNE-EN 61189-2-719:2016 (Ratificada)

Status: VIGENTE / 2016-11-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (Endorsed by AENOR in November of 2016.)

UNE-EN 60068-3-13:2016 (Ratificada)

Status: VIGENTE / 2016-10-01

Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering (Endorsed by AENOR in October of 2016.)

UNE-EN 61249-2-43:2016 (Ratificada)

Status: VIGENTE / 2016-08-01

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)

UNE-EN 61249-2-44:2016 (Ratificada)

Status: VIGENTE / 2016-08-01

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by AENOR in August of 2016.)

UNE-EN 62326-20:2016 (Ratificada)

Status: VIGENTE / 2016-06-01

Printed boards - Part 20: Printed circuit boards for high-brightness LEDs (Endorsed by AENOR in June of 2016.)

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