Committee

Committee:

CTN 203/SC 91-119 - Electronics assembly technology and printed electronics

Secretary:
SERCOBE - ASOCIACIÓN NACIONAL DE FABRICANTES DE BIENES DE EQUIPO
International Relations:

IEC/TC 91  Electronics assembly technology

IEC/TC 119  Printed Electronics

CLC/SR 91  Electronics assembly technology

CLC/SR 119  Printed electronics

Standards developed by the committee: CTN 203/SC 91-119: 311

UNE-EN IEC 61188-6-1:2021 (Ratificada)

Status: VIGENTE /  2021-05-01

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Española de Normalización in May of 2021.)

UNE-EN IEC 61189-5-501:2021 (Ratificada)

Status: VIGENTE /  2021-04-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (Endorsed by Asociación Española de Normalización in April of 2021.)

UNE-EN IEC 61189-5-502:2021 (Ratificada)

Status: VIGENTE /  2021-04-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (Endorsed by Asociación Española de Normalización in April of 2021.)

UNE-EN IEC 61189-5-601:2021 (Ratificada)

Status: VIGENTE /  2021-04-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (Endorsed by Asociación Española de Normalización in April of 2021.)

UNE-EN IEC 61188-6-2:2021 (Ratificada)

Status: VIGENTE /  2021-04-01

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (Endorsed by Asociación Española de Normalización in April of 2021.)

UNE-EN IEC 61760-3:2021 (Ratificada)

Status: VIGENTE /  2021-04-01

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (Endorsed by Asociación Española de Normalización in April of 2021.)

UNE-EN IEC 61760-1:2020 (Ratificada)

Status: VIGENTE /  2020-11-01

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (Endorsed by Asociación Española de Normalización in November of 2020.)

UNE-EN IEC 61189-5-504:2020 (Ratificada)

Status: VIGENTE /  2020-07-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (Endorsed by Asociación Española de Normalización in July of 2020.)

UNE-EN IEC 62878-1:2019 (Ratificada)

Status: VIGENTE /  2020-01-01

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates (Endorsed by Asociación Española de Normalización in January of 2020.)

UNE-EN 61191-2:2017/AC:2019-10 (Ratificada)

Status: VIGENTE /  2019-12-01

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Española de Normalización in December of 2019.)

UNE-EN IEC 62878-2-5:2019 (Ratificada)

Status: VIGENTE /  2019-12-01

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (Endorsed by Asociación Española de Normalización in December of 2019.)

UNE-EN 60068-2-69:2017/A1:2019 (Ratificada)

Status: VIGENTE /  2019-10-01

Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (Endorsed by Asociación Española de Normalización in October of 2019.)

UNE-EN IEC 60068-2-82:2019 (Ratificada)

Status: VIGENTE /  2019-08-01

Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for components and parts used in electronic assemblies (Endorsed by Asociación Española de Normalización in August of 2019.)

UNE-EN IEC 61188-6-4:2019 (Ratificada)

Status: VIGENTE /  2019-08-01

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (Endorsed by Asociación Española de Normalización in August of 2019.)

UNE-EN IEC 61191-1:2018 (Ratificada)

Status: VIGENTE /  2018-12-01

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (Endorsed by Asociación Española de Normalización in December of 2018.)

UNE-EN IEC 61189-2-630:2018 (Ratificada)

Status: VIGENTE /  2018-11-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (Endorsed by Asociación Española de Normalización in November of 2018.)

UNE-EN 61760-4:2015/A1:2018 (Ratificada)

Status: VIGENTE /  2018-06-01

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (Endorsed by Asociación Española de Normalización in June of 2018.)

UNE-EN 60068-2-58:2015/A1:2018 (Ratificada)

Status: VIGENTE /  2018-05-01

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by Asociación Española de Normalización in May of 2018.)

UNE-EN IEC 61249-2-45:2018 (Ratificada)

Status: VIGENTE /  2018-05-01

Materials for printed boards and other interconnecting structures – Part 2-45: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

UNE-EN IEC 61249-2-46:2018 (Ratificada)

Status: VIGENTE /  2018-05-01

Materials for printed boards and other interconnecting structures – Part 2-46: Reinforced base materials clad and unclad – Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m•K) and defined flammability (vertical burning test), copper-clad for lead-free assembly

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