Committee

Committee:

CTN 203/SC 91-119 - Electronics assembly technology and printed electronics

Secretary:
SERCOBE - ASOCIACIÓN NACIONAL DE FABRICANTES DE BIENES DE EQUIPO
International Relations:

IEC/TC 91  Electronics assembly technology

IEC/TC 119  Printed Electronics

CLC/SR 91  Electronics assembly technology

CLC/SR 119  Printed electronics

Standards developed by the committee: CTN 203/SC 91-119: 311

UNE-EN 61190-1-2:2002 (Ratificada)

Status: ANULADA /  2010-05-01

Attachment materials for electronic assembly -- Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly (Endorsed by AENOR in November of 2002.)

UNE-EN 61760-2:1998 (Ratificada)

Status: ANULADA /  2010-05-01

SURFACE MOUNTING TECHNOLOGY. PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) . APPLICATION GUIDE. (Endorsed by AENOR in July of 1998.)

UNE-EN 61189-2/AC:1997 (Ratificada)

Status: ANULADA /  2009-09-01

TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES. CORRIGENDUM. (Endorsed by AENOR in June of 1999.)

UNE-EN 61189-2:1997 (Ratificada)

Status: ANULADA /  2009-09-01

TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES (Endorsed by AENOR in November of 1997.)

UNE-EN 61189-2:1997/A1:2000 (Ratificada)

Status: ANULADA /  2009-09-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures (Endorsed by AENOR in November of 2000.)

UNE-EN 60068-2-21:2000

Status: ANULADA /  2009-07-01

ENVIRONMENTAL TESTING. PART 2-21: TESTS. TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES

UNE-EN 61760-1:1998 (Ratificada)

Status: ANULADA /  2009-06-01

SURFACE MOUNTING TECHNOLOGY -- PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) (Endorsed by AENOR in February of 1999.)

UNE-EN 60068-2-58:2000

Status: ANULADA /  2007-09-01

ENVIRONMENTAL TESTING -- PART 2-58: TEST - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)

UNE-EN 62326-1:1998

Status: ANULADA /  2005-06-01

PRINTED BOARDS. PART 1: GENERIC SPECIFICATION.

UNE-EN 60249-2-16/A1:1997

Status: ANULADA /  2001-12-31

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS Nº 16: POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).

UNE-EN 60249-2-16/A2:1997

Status: ANULADA /  2001-12-31

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 16: POLYMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).

UNE-EN 60249-2-17/A1:1997

Status: ANULADA /  2001-12-31

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 17: THIN POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARD.

UNE-EN 60249-2-17/A2:1997

Status: ANULADA /  2001-12-31

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 17: THIN POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.

UNE-EN 60249-2-18/A1:1997

Status: ANULADA /  2001-12-31

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICTION Nº 18: BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).

UNE-EN 60249-2-18/A2:1997

Status: ANULADA /  2001-12-31

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICTION Nº 18: BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).

UNE-EN 60249-2-11/A2:1996

Status: ANULADA /  2001-12-31

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 11: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.

UNE-EN 60249-2-11/A3:1996

Status: ANULADA /  2001-12-31

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 11:THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.

UNE-EN 60249-2-12/A2:1996

Status: ANULADA /  2001-12-31

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.

UNE-EN 60249-2-14/A4:1996

Status: ANULADA /  2001-12-31

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 14: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), ECONOMIC QUALITY.

UNE-EN 60249-2-14/A3:1996

Status: ANULADA /  2001-12-31

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 14: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), ECONOMIC QUALITY.

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