Committee:
IEC/TC 91 Electronics assembly technology
IEC/TC 119 Printed Electronics
CLC/SR 91 Electronics assembly technology
CLC/SR 119 Printed electronics
Standards developed by the committee: CTN 203/SC 91-119: 313
Status: ANULADA / 2014-02-06
CAPDS: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES. (Endorsed by AENOR in September of 1996.)
CAPDS: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES. (Endorsed by AENOR in September of 1996.)
CAPDS: MULTILAYER PRINTED BOARDS. (Endorsed by AENOR in September of 1996.)
Status: ANULADA / 2012-05-03
PRINTED BOARDS. DESIGN AND USE OF PRINTED BOARDS
PRINTED BOARDS. PART 3: DESIGN AND USE OF PRINTED BOARDS
PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED BOARDS WITH PLATED-THROUGH HOLES
PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED BOARDS WITH PLAIN HOLES
PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
PRINTED BOARDS. SPECIFICATION FOR SINGLE AND DOUBLE SIDED FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS
PRINTED BOARDS. SPECIFICATION FOR MULTILAYER PRINTED BOARDS
PRINTED BOARDS. TEST METHODS
SYMBOL OF CODE FOR HOLES OF PRINTED CIRCUITS
DESIGN AND USAGE OF ELEMENTS FOR WIRED AND PRINTED CIRCUITS.
DESIGN AND USE OF COMPONENTS INTENTED FOR MOUNTING ON BOARD WITH WIRING AND PRINTED CIRCUITS
METAL-CLAS BASE MATERIALS FOR PRINTED CIRCUITS. SPECIAL MATERIALS. SPECIFICATION NO.1: PRE-PREG FOR MULTILAYER PRINTED BOARDS
METAL-CLAD BASE MATERIALS FOR PRINTED CIRCUITS. COPPER FOIL
TERMS AND DEFINITIONS FOR PRINTED CIRCUITS.
Status: ANULADA / 2010-12-01
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) (Endorsed by AENOR in November of 1997.)
Back to results New Search
Design your own personalised collection of standards. Keep your standards updated.
