Committee:
IEC/TC 91 Electronics assembly technology
IEC/TC 119 Printed Electronics
CLC/SR 91 Electronics assembly technology
CLC/SR 119 Printed electronics
Standards developed by the committee: CTN 203/SC 91-119: 313
Status: ANULADA / 2017-11-23
Printed board design, manufacture and assembly - Terms and definitions (IEC 60194:2006). (Endorsed by AENOR in September of 2006.)
Status: ANULADA / 2017-11-16
CAPDS: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS. (Endorsed by AENOR in September of 1996.)
Capability Detail Specification: Flexible printed boards without through connections
SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS. (Endorsed by AENOR in November of 1996.)
SS: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS. (Endorsed by AENOR in September of 1996.)
SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLAIN HOLES. (Endorsed by AENOR in June of 1996.)
SECTIONAL SPECIFICATION: SINGLE AND DOUBLE-SIDED PRINTED BOARDS WITH PLAIN HOLES. (Endorsed by AENOR in June of 1996.)
SECTIONAL SPECIFICATION: SINGLE AND DOUBLE SIDED PRINTED BOARDS WITH PLATED-THROUGH HOLES. (Endorsed by AENOR in June of 1996.)
SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS. (Endorsed by AENOR in June of 1996.)
Sectional Specification: Multilayer printed boards
SECTIONAL SPECIFICACION: MULTILAYER PRINTED BOARDS. (Endorsed by AENOR in June of 1996.)
Status: ANULADA / 2017-11-14
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN (Endorsed by AENOR in October of 2004.)
Status: ANULADA / 2017-10-11
Sectional Specification: Flex-rigid double sided printed board with through connections
SECTIONAL SPECIFICATION: FLEXIBLE MULTILAYER PRINTED BOARDS WITH THROUGH CONNECTIONS (Endorsed by AENOR in November of 1997.)
Sectional Specification: Flex-rigid multilayer printed boards with through connections
Status: ANULADA / 2017-03-27
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Status: ANULADA / 2016-07-11
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Status: ANULADA / 2016-06-26
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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