Committee:
IEC/TC 91 Electronics assembly technology
IEC/TC 119 Printed Electronics
CLC/SR 91 Electronics assembly technology
CLC/SR 119 Printed electronics
Standards developed by the committee: CTN 203/SC 91-119: 311
Status: ANULADA / 2021-04-08
Base materials for printed circuits -- Part 2: Specifications -- Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test).
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº5: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
Status: ANULADA / 2021-01-18
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
Status: ANULADA / 2020-10-14
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by AENOR in November of 2013.)
Status: ANULADA / 2020-08-31
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Status: ANULADA / 2020-07-05
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Status: ANULADA / 2020-05-17
Product package labels for electronic components using bar code and two- dimensional symbologies
Status: ANULADA / 2020-05-16
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
Status: ANULADA / 2020-04-12
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
Status: ANULADA / 2019-11-28
Grid systems for printed circuits
Status: ANULADA / 2019-04-25
Workmanship requirements for soldered electronic assemblies - Part 1: General
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
Status: ANULADA / 2018-05-02
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Status: ANULADA / 2017-11-23
Printed board design, manufacture and assembly - Terms and definitions (IEC 60194:2006). (Endorsed by AENOR in September of 2006.)
Status: ANULADA / 2017-11-16
CAPDS: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS. (Endorsed by AENOR in September of 1996.)
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