Committee:
IEC/TC 91 Electronics assembly technology
IEC/TC 119 Printed Electronics
CLC/SR 91 Electronics assembly technology
CLC/SR 119 Printed electronics
Standards developed by the committee: CTN 203/SC 91-119: 313
Status: VIGENTE / 1996-07-24
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 6: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (HORIZONTAL BURNING TEST).
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 7: PHENOLIC CELLULOSE PAPER COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM.
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 9: EPOXIDE CELLULOSE PAPER CORE, EPOXIDE GLASS CLOTH SURFACE COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
Status: VIGENTE / 1996-06-01
GENERIC SPECIFICATION: PRINTED BOARDS. (Endorsed by AENOR in June of 1996.)
Status: ANULADA / 2025-04-24
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
Status: ANULADA / 2024-08-21
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Status: ANULADA / 2024-08-13
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
Status: ANULADA / 2024-05-05
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
Status: ANULADA / 2024-03-31
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
Status: ANULADA / 2024-03-11
Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
Status: ANULADA / 2023-09-21
Film and hybrid integrated circuits - Part 5: Procedure for qualification approval
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description (Endorsed by AENOR in August of 2012.)
Status: ANULADA / 2023-08-19
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
Status: ANULADA / 2022-09-29
Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
Status: ANULADA / 2022-06-19
Environmental testing -- Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components
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