Committee:
IEC/TC 47 Semiconductor devices
CLC/TC 47X Semiconductors and Trusted Chips Implementation
Standards developed by the committee: CTN 209/SC 47: 299
Status: VIGENTE / 2006-04-12
Plasma display panels -- Part 3-1: Mechanical interface
Status: VIGENTE / 2006-04-01
Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz -- Part 5: Workbench Faraday cage method (Endorsed by AENOR in April of 2006.)
Status: VIGENTE / 2006-01-01
Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz -- Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method (Endorsed by AENOR in January of 2006.)
Status: VIGENTE / 2005-04-01
Liquid crystal display devices -- Part 2-2: Matrix colour LCD modules - Blank detail specification (Endorsed by AENOR in April of 2005.)
Liquid crystal display devices -- Part 4-1: Matrix colour LCD modules - Essential ratings and characteristics (Endorsed by AENOR in April of 2005.)
Status: VIGENTE / 2005-03-16
Semiconductor devices - Mechanical and climatic test methods -- Part 33: Accelerated moisture resistance - Unbiased autoclave
Semiconductor devices - Mechanical and climatic test methods -- Part 23: High temperature operating life
Semiconductor devices - Mechanical and climatic test methods -- Part 24: Accelerated moisture resistance - Unbiased HAST
Status: VIGENTE / 2004-11-01
Semiconductor devices -- Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits (Endorsed by AENOR in November of 2004.)
Semiconductor devices -- Part 16-4: Microwave integrated circuits - Switches (Endorsed by AENOR in November of 2004.)
Status: VIGENTE / 2004-06-11
Semiconductor devices - Mechanical and climatic test methods -- Part 14: Robustness of terminations (lead integrity)
Semiconductor devices - Mechanical and climatic test methods -- Part 25: Temperature cycling
Status: VIGENTE / 2004-05-28
Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
Semiconductor devices - Mechanical and climatic test methods -- Part 8: Sealing
Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
Status: VIGENTE / 2004-03-26
Semiconductor devices - Mechanical and climatic test methods -- Part 22: Bond strength
Status: VIGENTE / 2004-03-18
Semiconductor devices - Mechanical and climatic test methods -- Part 31: Flammability of plastic-encapsulated devices (internally induced)
Semiconductor devices - Mechanical and climatic test methods -- Part 32: Flammability of plastic-encapsulated devices (externally induced)
Semiconductor devices - Mechanical and climatic test methods -- Part 36: Acceleration, steady state
Status: VIGENTE / 2003-11-21
Semiconductor devices. Mechanical and climatic test methods. Part 16: Particle impact noise detection (PIND)
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