Committee:
IEC/TC 47 Semiconductor devices
CLC/TC 47X Semiconductors and Trusted Chips Implementation
Standards developed by the committee: CTN 209/SC 47: 299
Status: ANULADA / 2020-04-08
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
Status: ANULADA / 2020-03-04
EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
Status: ANULADA / 2019-11-02
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
Status: ANULADA / 2019-02-11
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
Status: ANULADA / 2018-12-04
Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 1: General conditions and definitions
Status: ANULADA / 2018-05-17
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass (Endorsed by AENOR in August of 2015.)
Status: ANULADA / 2017-10-26
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting (Endorsed by Asociación Española de Normalización in May of 2017.)
Status: ANULADA / 2017-04-15
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
Status: ANULADA / 2016-11-14
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages.
Status: ANULADA / 2016-04-23
Liquid crystal and solid-state display devices - Part 2-1: Passive matrix monochrome LCD modules - Blank detail specification (Endorsed by AENOR in October of 2001.)
Status: ANULADA / 2015-11-01
LIQUID CRYSTAL AND SOLID-STATE DISPLAY DEVICES. PART 4: LIQUID CRYSTALDISPLAY MODULES AND CELLS. ESSENTIAL RATINGS AND CHARACTERISTICS (Endorsed by AENOR in February of 1999.)
Status: ANULADA / 2015-07-31
Liquid crystal and solid-state display devices -- Part 6: Measuring methods for liquid crystal modules - Transmissive type (Endorsed by AENOR in September of 2004.)
Status: CANCELLED / 2015-03-01
Plasma display panels -- Part 2-1: Measuring methods -- Optical.
Plasma display panels -- Part 2-2: Measuring methods - Optoelectrical
Status: ANULADA / 2014-08-31
Plasma display panels -- Part 1: Terminology and letter symbols
Status: ANULADA / 2014-07-22
Semiconductor devices - Mechanical and climatic test methods -- Part 7: Internal moisture content measurement and the analysis of other residual gases.
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