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IEC 60749-39:2006

IEC 60749-39:2006

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 39: Mesure de la diffusion d'humidité et de l'hydrosolubilité dans les matériaux organiques utilisés dans les composants à semiconducteurs

Date:
2021-11-29 /Anulada
Summary (English):
Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.
Summary (French):
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