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IEC 60749-15:2003

IEC 60749-15:2003

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 15: Résistance à la température de soudage pour dispositifs par trous traversants

Date:
2010-10-28 /Anulada
Summary (English):
Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.
Summary (French):
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