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IEC 60249-2-13:1987

IEC 60249-2-13:1987

Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade

Matériaux de base pour circuits imprimés. Deuxième partie: Spécifications. Spécification n° 13: Film flexible de polyimide recouvert de cuivre, de qualité courante

Date:
2004-10-15 /Anulada
Summary (English):
Gives requirements for properties of flexible copper-clad polyimide film, general purpose grade including optional requirements which apply only by agreement between purchaser and supplier. The material consists of an insulating flexible film base with copper foil bonded to one or both sides, with or without the use of an adhesive.
Summary (French):
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